FMXMC3S2118FHC-61.500000MHz,5032mm,FMI微处理器晶体，美国进口晶振，FMI晶振，型号：FMXMC3S2，编码为：FMXMC3S2118FHC-61.500000MHz，负载：18pF，精度：±20ppm，稳定性：±30ppm，工作温度范围：-40℃至+85℃，频率为：61.500MHz，小体积晶振尺寸：5.0x3.2x0.9mm，两脚贴片晶振，石英晶振，5032晶振，无源晶振，石英晶体谐振器，SMD晶振。具有超小型，轻薄型，高性能，高品质，耐热及耐环境特点。应用于：通讯设备晶振，蓝牙模块晶振，无线局域网晶振，平板电脑晶振，智能家居等应用。
FMXMC3S2118FHC-61.500000MHz,5032mm,FMI微处理器晶体，产品特点：
陶瓷SMD 5.0x3.2mm微处理器晶体
表面安装陶瓷包装，石英晶体谐振器
高可靠性，紧固性
FMXMC3S2118FHC-61.500000MHz,5032mm,FMI微处理器晶体,参数表
| Parameter | Specification | ||||||||||||||||
| Frequency Range | 61.500 MHz | ||||||||||||||||
| Operation Mode | See Operation Mode and ESR Table | ||||||||||||||||
| Load Capacitance (CL) | 18 pF Std., 6 - 60 pF and Series available | ||||||||||||||||
| Frequency Tolerance | ±30 ppm @ 25°C Std. (See Cal. Tol. for Options) | ||||||||||||||||
| Temperature Tolerance | ±50 ppm Std. (See Temp. Tol. for Options) | ||||||||||||||||
| Operating Temperature | 0 to +70°C Std. (See Temp. Range for Options) | ||||||||||||||||
| Storage Temperature | -40 to +85°C / -55 to +125°C | ||||||||||||||||
| Equivalent Series Resistance (ESR) | See Operation Mode and ESR Table | ||||||||||||||||
| Shunt Capacitance (C0) | 7 pF max. | ||||||||||||||||
| Drive Level | 10 µW typical, 300 µW max | ||||||||||||||||
| Aging @ 25°C | ±5 ppm per year max. | ||||||||||||||||
| Insulation Resistance | 500MΩ min. at 100VDC±15V | ||||||||||||||||
| Reflow Conditions | 260°C ±10°C for 10sec max., 2 reflows max. | ||||||||||||||||
FMXMC3S2118FHC-61.500000MHz,5032mm,FMI微处理器晶体,尺寸图
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