无源贴片晶振产品非常适合用于医疗遥测(MICS, BLE),军事与航空航天,航空电子指示器和仪器,座舱仪表显示,数据通信,遥测,工业,计算机和通信,通信,发射器,脉冲发电机,跟踪信号,野生动物遥测等领域.CX11SCSM1-25.0M,50/50/-/I,9pF|Statek音叉晶体|6G通信晶振.
CX11SCSM1-25.0M,50/50/-/I,9pF|Statek音叉晶体|6G通信晶振参数表
CX11SCSM1-25.0M,50/50/-/I,9pF|Statek音叉晶体|6G通信晶振 尺寸图
Fundamental Frequency
16.0 MHz
25.0 MHz
155.52 MHz
Motional Resistance R1(Ω)
90
30
25
Motional Capacitance C1(fF)
1.5
1.6
2.8
Quality Factor Q
70,000
140,000
15,000
Shunt Capacitance C0(pF)
0.7
0.7
1.4
Calibration Tolerance1
±50 ppm to ±10 ppm
Load Capacitance
Customer specified (9 pF standard)
Drive Level
200 µW MAX
Frequency-Temperature Stability1,2,3
±50 ppm to ±10 ppm (Commercial)
±50 ppm to ±20 ppm (Industrial)
±50 ppm to ±30 ppm (Military)
Aging, First Year4
3 ppm MAX
Shock Survival
5,000 g, 0.3 ms,1⁄2sine
Vibration Survival5
20 g, 10-2,000 Hz swept sine
Operating Temperature Range3
-10°C to +70°C (Commercial)
-40°C to +85°C (Industrial)
-55°C to +125°C (Military)
Storage Temperature Range3
-55°C to +125°C
Max Process Temperature
260°C for 20 seconds
Moisture Sensitivity Level (MSL)
This component is hermetically sealed and is not moisture sensitive.
CX11SCSM1-25.0M,50/50/-/I,9pF|Statek音叉晶体|6G通信晶振
晶体产品特性: